SINTRONES ABOX-5210G-M12X

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Productgroepen > Embedded PC > SINTRONES ABOX-5210G-M12X

SINTRONES ABOX-5210G-M12X

Intel Gen 10th 10 Cores Xeon, i9 CPU w/ 10 x GbE (2 x RJ45 and 8 x M12 X Coded Connectors)/ 3 x COM/ 3 x DP/ 2 x HDMI/ 4 x USB 3.2 Gen 1/ NVIDIA® GeForce GTX GPU/ 9-48V Input AI GPU Computing

SINTRONES ABOX-5210G-M12X
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  • Intel GEN 10th 10 Cores Xeon W-1290TE / i9-10900TE
  • NVIDIA® GeForce GTX GPU
  • 8 x DI, and 4 x DO and 3 x RS-232/422/485
  • 1 x M.2 B key, 1 x M.2 A-E key & 3 x MiniPCIe expansion slots
  • Dual Hot Swappable SATA Storage RAID 0,1,5
  • 9-48V DC Input and Operating Temp.: -40~70°C
  • 2 x RJ45 Ports and 8 x M12 X Coded Connectors for GbE (Optional 8 x PoE)
  • Rolling Stock EN 50155 and EN 50121-3-2 certified

The ABOX-5210(G)-M12X Fanless Box Computer is powered by Intel GEN 10th 10 Cores Xeon W-1290TE / i9-10900TE AI GPU Computing. Specifically designed for railway rolling stock applications, it guarantees reliable performance, withstanding environmental disturbances such as severe shock and vibration in railway vehicle applications. ABOX-5210(G)-M12X features 8 x M12 X Coded Connectors for GbE and certified Rolling Stock EN50155 & EN50121-3-2 that cater to rolling stock’s application including traffic safety systems, passenger information systems, broadcasting systems as well as surveillance systems and more. Furthermore, with the new Intel Gen 10 Comet Lake and NVIDIA® GeForce GTX 1650 or GTX 1060 technology’s outstanding performance, ABOX-5210(G)-M12X can effectively support smart public transit systems, offering solutions to enhance the operational efficiency of railways and railway station management.
ProdGrafik

SPECIFICATIONS

System

    CPU
    Intel Gen10 Xeon W-1290TE (20M Cache 2.0GHz up to 4.6GHz)*
    Intel Gen10 Core i9-10900TE (20M Cache 2.0GHz up to 4.5GHz)
    Intel Gen10 Core i7-10700TE (16M Cache 2.0GHz up to 4.4GHz)
    Intel Gen10 Core i5-10500TE (12M Cache 2.3GHz up to 3.7GHz)
    Intel Gen 10 Core i3-10100TE (6M Cache 2.3GHz up to 3.6GHz)
    Intel Gen10 Core G5900TE (4M Cache 3.0GHz)
    *Use only with Intel W480

    Chipset
    Q470E / W480E

    Memory
    2 x DDR4 2666/2933 MHz SO-DIMM up to 64GB

    LAN Chipset
    9 x Intel i210-AT and 1 x i219LM (support iAMT)
    Gb/s Ethernet Controllers Onboard Support PXE and WOL

    Watchdog
    1 ~ 255 Level Reset

    TPM
    2.0



I/O

    Serial Port
    3 x RS 232/422/485 (option additional 1 x RS 232/422/485)

    USB Port
    4 x USB 3.2 Gen 1 Ports

    LAN
    2 x RJ45 Ports and 8 x M12 X coded connectors for GbE
    (Optional with 8 x POE total Max.120W)

    Video Port
    3 x DP, 2 x HDMI Ports from NVIDIA® GeForce GTX GPU

    DIO Port
    8 xDI (5~48VDC) and 4 x DO (5VDC, 100mA)

    Audio
    1 x Line-out, 1 x Line-in and 1 x Mic-in

    Expansion Bus
    2 x Full Mini-PCle Slots
    1 x Mini-PCIe w/ USB interface only for LTE sharing 2 x SIM Card Sockets with M.2 B Key 3042 slot
    1 x M.2 A-E Key 2230 slot, 1 x M.2 B Key 3042 slot w/ 2 x SIM Card Sockets for LTE



Graphics

    CPU Built-in Graphics
    Intel® UHD Graphics 630
    Max Resolution (DP) : 4096x2304@60Hz

    MXM Graphics
    NVIDIA® GeForce GTX 1650 GPU (896 CUDA Cores) w/4GB GDDR5
    Max Resolution (HDMI) : 3840x2160@60Hz



Storage

    Type
    2 x 2.5" Drive Bay for SATA Type HDD/SSD RAID 0, 1, 5
    1 x M.2 M key 2280 slot supports NVMe and SATA SSD
    * Thermal heatsink is required for M.2 storage. Please contact us for more information.



Power Requirement

    Power Input
    9V -48V DC Power Input

    Power Protection
    Automatics Recovery Short Circuit Protection

    Power Management
    Vehicle Power Ignition for Variety Vehicle

    Power Off Control
    Power off Delay Time Setting by Software and BIOS

    Battery Backup (Option)
    Internal Battery Kit for 10 Mins Operating (P/N: BAT-5200 kit, Operating Temp. -20 ~ 60°C)



Mechanical & Environmental

    Dimensions (LxWxH)
    260 x 250 x 95 mm

    Mounting
    Wall-mount

    Weight
    5300g (bare-bone)

    Relative Humidity
    10% RH – 90% RH (non-condensing)

    Operating Temp.
    -40°C ~ 70°C w/0.6 m/S airflow

    Storage Temp.
    -40°C ~ 80°C

    Certifications
    CE, FCC Class A, E13, EN50155

    Patent No. (Taiwan)
    M592609 - Automatic SIM Card Detection
    M565941 - Thermal Cooling
    M447854 - Build-in Battery




ORDERING INFORMATION

Available Modules
ABOX-5210Gx-M12X-yy
(x=B, yy= Z9, i9, i7, i5, i3 or C1)
(B=NVIDIA® GeForce GTX 1650 GPU, Z9=Intel Gen10 Xeon W-1290TE)
Intel Gen 10th 10 Cores Xeon, i9 CPU w/ 10 x GbE (2 x RJ45 and 8 x M12 X Coded Connectors)/ 3 x COM/ 3 x DP/ 2 x HDMI/ 4 x USB 3.2 Gen 1/ NVIDIA® GeForce GTX GPU/ 9-48V Input AI GPU Computing
Optional Accessories
DRAM DDR4-2933 MHz SO-DIMM, 4GB~32GB, 0~70°C/-40~85°C
SSD M.2 2280 B-M key NVMe TLC -40~85°C 64GB~1TB w/ Heatsink
M.2 2280 B-M key SATA TLC -40~85°C 64GB~1TB w/ Heatsink
2.5 inch SATA TLC -40~85°C 64GB~2TB
Wifi M.2 2230 A-E key 802.3 a/b/g/n/ac
Modem M.2 3042 B key LTE module
GPS MiniPCIe GPS module
CANBUS MiniPCIe CANBUS module
Battery backup kit BAT-5200 Battery Kit, 5200m/h, -30~60ºC, discharge -20~60ºC, operating about 10 mins
Power adapter AC/DC 220W/24V or 280W/24V power adapter



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